| 摘要 |
PROBLEM TO BE SOLVED: To provide an inorganic polysilazane resin allowing reduction in problems such as shrinkage and residual stress of a film after siliceous film conversion while keeping various properties such as insulation properties, film surface smoothness, resistance against acid/alkali and solvents and high barrier property, and allowing formation of a siliceous film with high-density; a method for formation a siliceous film using this; and a siliceous film formed by this method.SOLUTION: The inorganic polysilazane resin of the present invention is an inorganic polysilazane resin comprising a silicon atom and a nitrogen atom and having a ratio Si/N of the silicon atom to the nitrogen atom of 1.30 or more. Such an inorganic polysilazane resin having a high Si content can be manufactured by, for example, a method where an inorganic polysilazane compound comprising both Si-NH and Si-Cl is heated to react NH and Cl; a method where a silazane oligomer (polymer) with no Si-Cl bond is synthesized, followed by adding dihalosilane thereto for heat reaction; or the like. The siliceous film is formed, for example, by coating a substrate with a coating composition containing the above inorganic polysilazane resin, drying and then oxidation, in the heated state, by contact with water vapor or with hydrogen peroxide vapor and water vapor. |
