SUBSTRATE BONDING PROCESS WITH INTEGRATED VENTS

摘要

In one method embodiment, a method for bonding a capping substrate (216) to a base substrate (208) comprises providing a capping substrate with a plurality of vents (214) extending through the capping substrate and sealing the capping substrate to the base substrate. In one embodiment, an apparatus comprising a base substrate, a capping substrate sealed to the base substrate and formed with a plurality of vents extending through the capping substrate, and sealant closing each of the plurality of vents.