发明名称 |
METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND INTERCONNECT COMPONENT RECOVERY PROCESS |
摘要 |
A method is provided for making an interconnect structure. The method includes applying a removable layer to an electronic device or to a base insulative layer; applying an adhesive layer to the electronic device or to the base insulative layer; and securing the electronic device to the base insulative layer using the adhesive layer.
|
申请公布号 |
US2008318413(A1) |
申请公布日期 |
2008.12.25 |
申请号 |
US20070766302 |
申请日期 |
2007.06.21 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
FILLION RAYMOND ALBERT;ESLER DAVID RICHARD;ERLBAUM JEFFREY SCOTT;MILLS RYAN CHRISTOPHER;WOYCHIK CHARLES GERARD |
分类号 |
H01L21/4763 |
主分类号 |
H01L21/4763 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|