| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and method for manufacturing a multi-layer printed circuit board which does not have poor penetration and which has high productivity. SOLUTION: A method for manufacturing a multi-layer printed circuit board has a means for providing a first roller, a second roller disposed with its rotation axis being in parallel and having a predetermined interval with the first roller, a conductive foil, an insulation resin sheet, and an exfoliation sheet, in such a way that the insulation resin sheet is held in between a first face of the conductive foil and the exfoliation sheet and passes through a gap between the first and second rollers; a means for driving for driving the first and second rollers, in such a way that the rotational speeds of the first and second rollers and the supplying speed of the conductive foil, insulation resin sheet, and exfoliation sheet provided to pass through the gap therebetween are synchronizes; and a means for adjustment for adjusting the size of the gap between the first and second rollers so that conductive bumps penetrate an insulation resin layer. COPYRIGHT: (C)2009,JPO&INPIT
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