BASE FILM FOR DICING, AND DICING FILM

摘要

PROBLEM TO BE SOLVED: To provide a dicing film which hardly causes chipping when cutting a semiconductor wafer into chips in a dicing process of the semiconductor wafer. SOLUTION: A base film for dicing contains at least one layer of an (A) layer which contains a resin composition wherein 5-100 pts.wt. of a hydrogen-added styrene-butadiene copolymer, a polypropylene-based resin, or a mixture of these is mixed into 100 pts.wt. of a hydrogen-added styrene-isoprene copolymer. The dicing film including the base film for dicing is also provided. COPYRIGHT: (C)2009,JPO&INPIT