| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC built-in substrate capable of eliminating the shortage of strength of a resin substrate and improving the function as well as the characteristics as a module product. <P>SOLUTION: The IC built-in substrate 100 includes a resin multilayer substrate 11, an IC chip 12 embedded in the resin multilayer substrate 11 and a metal frame 13 embedded in the resin multilayer substrate 11 together with the IC chip 12. The annular metal frame 13 is embedded in the inner layer of the resin multilayer substrate 11 and the annular metal frame 13 is provided so as to surround the IC chip 12, thereby the metal frame 13 can function as a heat sink. Further, the metal frame 13 is provided in the same layer as the IC chip 12, so that a thickness same as that of the IC chip 12 can be secured, thereby securing a sufficient strength as a stiffener. <P>COPYRIGHT: (C)2010,JPO&INPIT |
