发明名称 COMPONENT SUPPORT FOR DENSE CIRCUIT BOARD
摘要 A support apparatus for a component is provided and includes a periphery entirely disposable within a footprint of the component on a surface of a substrate, a first portion having a first surface adhesively connectable to the component, a second portion having a second surface disposable to contact the surface of the substrate in discrete sectors and defining an aperture through which leads are extendable from the component and through the substrate, and vents extending between the discrete sectors from the aperture to the periphery, and bosses disposed to protrude from the second surface and into through-holes defined in the substrate.
申请公布号 WO2016145268(A1) 申请公布日期 2016.09.15
申请号 WO2016US21904 申请日期 2016.03.11
申请人 RAYTHEON COMPANY 发明人 MERCIER, Dennis W.;DELISLE, Corey R.;LOTT, Patrick J.;ZARKH, Dimitry
分类号 H05K3/30;H01G2/06;H05K3/34 主分类号 H05K3/30
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