| 摘要 |
PROBLEM TO BE SOLVED: To facilitate the separation of a temporary bonding between a semiconductor wafer and a carrier substrate after processing.SOLUTION: A composition 3 containing an adhesive material, a release additive and a copper passivation agent, is arranged between an active side of a semiconductor substrate 5 and two surfaces of a carrier substrate 1, and the adhesive material is cured thereby they are temporary bonded each other.SELECTED DRAWING: Figure 1A |
