| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal treatment device and a thermal treatment method that can thermally treat the whole surface of a substrate uniformly and in a short time.SOLUTION: A thermal treatment device 1 includes a plurality of first lift pins 51 for supporting the outer peripheral portion 91 of a substrate 9, and a plurality of second lift pins 52 for supporting the central portion 92 of the substrate 9. A temperature control mechanism 40 adjusts the temperature of at least the central area of a thermal treatment plate 30 to an excessive temperature over a target temperature. A controller 80 operates an elevating mechanism 60 to raise the second lift pins 52 when the temperature of the central portion 92 of the substrate 9 has reached the target temperature after the start of the thermal treatment, whereby the central portion 92 of the substrate 9 is separated from the thermal treatment plate 30. Thus, the entire surface of the substrate 9 can be thermally treated uniformly in a short time with respect to the center portion 92 of the substrate 9.SELECTED DRAWING: Figure 2 |
