| 摘要 |
A microelectromachanical apparatus (X) includes a mircoelectromechanical component (10), an insulating substrate (21), a through via (22c) disposed in the insulating substrate (21), a sealing member (30) and a conductive connecting member (40). The microelectromechanical device (10) has a semiconductor substrate (11), a microelectromechanical system (12) and an electrode (13) electrically connected to the microelectromechanical system (12). The sealing member (30) is made of glass, is disposed so as to enclose the microelectromechanical system (12) between the semiconductor substrate (11) and the insulating substrate (21), and hermetically seals the microelectromechanical system (12). The conductive connecting member (40) electrically connects the electrode (13) and an end of the through via (22c), at a position spaced away from the sealing member (30). |
