| 摘要 |
<p>A wafer (30) is polished by relatively moving a polishing body and the wafer (30) while applying a load between the polishing body and the wafer (30), with a polishing agent interposed between the polishing body and the wafer (30). A first step polishes the wafer (30) by using a hard polishing pad (42) as the polishing body while pressing the wafer (30) against the polishing pad (42) by air pressure. A second step following the first step uses a soft polishing pad as the polishing body to polish the wafer (30). This reduces erosion, dishing, etc., and provides a polished surface having few microscratches, further improving the flatness.</p> |
