METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

摘要

A method for fabricating a semiconductor device is provided to reduce a manufacturing cost by pattering a lower structure without using a high-priced exposure system. A pattern layer forming process is performed to form a pattern layer on an entire surface of a substrate. A first patterning process is performed by using a first mask of a line type. The first mask has a width corresponding to a width of the active region. A second patterning process is performed by using a second mask of a line type. The pattern layer is patterned by using the second mask having the width corresponding to the length of the active region.