| 发明名称 |
PROBE FOR TESTING SEMICONDUCTOR DEVICES |
| 摘要 |
A novel probe design is presented that increases a probe tolerance to stress fractures. Specifically, what is disclosed are three features increase stress tolerance. These features include a various union angle interface edge shapes, pivot cutouts and buffers.
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| 申请公布号 |
KR20090121410(A) |
申请公布日期 |
2009.11.25 |
| 申请号 |
KR20097023065 |
申请日期 |
2008.03.04 |
| 申请人 |
TOUCHDOWN TECHNOLOGIES, INC. |
发明人 |
TEA NIM;KHOO MELVIN;HU TING;AN ZHIYONG |
| 分类号 |
G01R1/067;G01R1/04;G01R31/26;H01L21/66 |
主分类号 |
G01R1/067 |
| 代理机构 |
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