发明名称 |
PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
Disclosed are a printed circuit board, a semiconductor package, and a manufacturing method thereof, capable of minimizing a solder bridge issue. The printed circuit board comprises: a circuit layer having an embedded pad embedded in an upper surface of an insulating layer; and a groove unit formed on the embedded pad. |
申请公布号 |
KR20160095520(A) |
申请公布日期 |
2016.08.11 |
申请号 |
KR20150016893 |
申请日期 |
2015.02.03 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHO, JUNG HYUN;KO, YOUNG GWAN;SEO, IL JONG;BAEK, YONG HO |
分类号 |
H05K3/34;H01L23/12;H05K1/18 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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