发明名称 OPTOELECTRONIC COMPONENT, OPTOELECTRONIC ASSEMBLY, METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC ASSEMBLY
摘要 An optoelectronic component may include an electrically conductive carrier structure having a first contact section and a carrier section, an organic functional layer structure which is formed above the carrier structure and which overlaps the carrier section and which does not overlap the first contact section, an electrically conductive covering structure, which is formed above the organic functional layer structure and which includes a covering section and a second contact section, wherein the covering section overlaps the organic functional layer structure and the carrier section, wherein the first contact section projects below the organic functional layer structure on a first side and on a third side of the optoelectronic component.
申请公布号 US2016240815(A1) 申请公布日期 2016.08.18
申请号 US201415030605 申请日期 2014.10.22
申请人 OSRAM OLED GMBH 发明人 Rosenberger Johannes;Wehlus Thomas
分类号 H01L51/52;H01L51/44 主分类号 H01L51/52
代理机构 代理人
主权项 1. An optoelectronic component, comprising: an electrically conductive carrier structure having a first contact section and a carrier section, an organic functional layer structure which is formed above the carrier structure and which overlaps the carrier section and which does not overlap the first contact section, an electrically conductive covering structure, which is formed above the organic functional layer structure and which comprises a covering section and a second contact section,wherein the covering section overlaps the organic functional layer structure and the carrier section,wherein the first contact section projects below the organic functional layer structure on a first side and on a third side of the optoelectronic component,wherein the covering structure does not overlap the first contact section,wherein the second contact section does not overlap the organic functional layer structure and the first contact section and projects above the organic functional layer structure on a second side and on a fourth side of the optoelectronic component,wherein the carrier structure does not overlap the second contact section,wherein the first side adjoins the third side and the first contact section is formed in an L-shaped fashion in plan view, andwherein the second side adjoins the fourth side and the second contact section is formed in an L-shaped fashion in plan view.
地址 Regensburg DE