发明名称 |
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTOR DEVICE |
摘要 |
In a semiconductor device including a transistor, an oxygen release type oxide insulating film is formed in contact with a channel formation region of the transistor. The channel formation region is formed in an oxide semiconductor film. Oxygen is supplied from the oxide insulating film to the oxide semiconductor film. Further, an oxygen barrier film which penetrates the oxide insulating film is formed around the channel formation region, whereby a diffusion of oxygen to the wiring, the electrode, and the like connected to the transistor can be suppressed. |
申请公布号 |
US2016240685(A1) |
申请公布日期 |
2016.08.18 |
申请号 |
US201615138539 |
申请日期 |
2016.04.26 |
申请人 |
Semiconductor Energy Laboratory Co., Ltd. |
发明人 |
TANAKA Tetsuhiro |
分类号 |
H01L29/786;H01L23/532;H01L29/66;H01L27/12 |
主分类号 |
H01L29/786 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor device comprising:
an oxide insulating film; a transistor comprising an oxide semiconductor film; a wiring electrically connected to the transistor; and a first oxygen barrier film in contact with the wiring, wherein the oxide semiconductor film is over the oxide insulating film, wherein the oxide semiconductor film comprises a channel formation region, wherein the first oxygen barrier film penetrates the oxide insulating film, wherein the first oxygen barrier film comprises aluminum oxide, and wherein the wiring comprises tungsten. |
地址 |
Atsugi-shi JP |