POWER PACKAGE LID

摘要

The present disclosure relates to a ring-frame power package. In this regard, the ring-frame power package includes a thermal carrier and a ring structure. The thermal carrier has a carrier surface. The ring structure includes a ring body that is disposed over the carrier surface of the thermal carrier so that a portion of the carrier surface is exposed through an interior opening of the ring body. The ring-frame power package also includes a power package lid that is disposed over the ring body. The power package lid includes a cavity in communication with the interior opening of the ring body. In this manner, the power package lid covers and protects semiconductor devices and corresponding wires encased by the ring-frame power package.

主权项

1. A ring-frame power package comprising:
a thermal carrier having a carrier surface; and a ring structure residing on the carrier surface of the thermal carrier, and comprising a ring body, wherein a portion of the carrier surface of the thermal carrier is exposed through an interior opening of the ring body; and a power package lid residing on the ring body and having a cavity in communication with the interior opening of the ring body.