SUBSTRATE COMPRISING STACKS OF INTERCONNECTS, INTERCONNECT ON SOLDER RESIST LAYER AND INTERCONNECT ON SIDE PORTION OF SUBSTRATE

摘要

An integrated circuit device that includes a package substrate and a die coupled to the package substrate. The package substrate includes at least one dielectric layer, a first stack of first interconnects in the at least one dielectric layer, and a second interconnect formed on at least one side portion of the at least one dielectric layer. The first stack of first interconnects is configured to provide a first electrical path for a non-ground reference signal, where the first stack of first interconnects is located along at least one side of the package substrate. The second interconnect is configured to provide a second electrical path for a ground reference signal.

主权项

1. An integrated circuit device comprising:
a die; and a package substrate coupled to the die, the package substrate comprising:
at least one dielectric layer;a first stack of first interconnects in the at least one dielectric layer, the first stack of first interconnects configured to provide a first electrical path for a non-ground reference signal, wherein the first stack of first interconnects is located along at least one side of the package substrate; anda second interconnect formed on at least one side portion of the at least one dielectric layer, wherein the second interconnect is configured to provide a second electrical path for a ground reference signal.