METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMPS AND STRUCTURES FORMED THEREBY

摘要

Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include modifying an underfill material with one of a thiol adhesion promoter, an azole coupling agent, surface modified filler, and peroxide based cross-linking polymer chemistries to greatly enhance adhesion in package structures utilizing the embodiments herein.

主权项

1. A method of forming a package structure comprising:
forming an underfill material on conductive bumps of the package structure, wherein the underfill material comprises a thiol based adhesion promoter, wherein the thiol based adhesion promoter comprises a molecular weight above about 150 g/mol.