UNDERFILL PROCESS AND PROCESSING MACHINE THEREOF

摘要

A processing machine of an underfill process comprises a carrier, an automated device, a scanning mechanism, an identifying device and a host. The carrier is suitable for carrying a package substrate provided with chips bonded thereon. The automated device has a dispenser for filling an underfill between each chip and the package substrate. The scanning mechanism is configured on the carrier, and the identifying device is driven by the scanning mechanism to move along a predetermined path over the package substrate and identify positions of the chips before the dispenser fills the underfill between each chip and the package substrate. The identifying device is suitable for outputting an identifying result of chip position, and a movement of the identifying device is independent from a movement of the dispenser. The host receives the identifying result and locates the dispenser of the automated device according to the identifying result.

主权项

1. A processing machine of an underfill process, the processing machine comprising:
a carrier, for carrying a package substrate provided with a plurality chips bonded thereon; an automated device, having a dispenser for filling an underfill between each of the chips and the package substrate; a scanning mechanism, configured on the carrier; an identifying device, driven by the scanning mechanism to move along a predetermined path over the package substrate and identify positions of the chips before the dispenser fills the underfill between each of the chips and the package substrate, wherein the identifying device is suitable for outputting an identifying result of chip position, and a movement of the identifying device is independent from a movement of the dispenser; and a host, electrically connected to the automated device and the identifying device, the host receiving the identifying result and locating the dispenser of the automated device according to the identifying result when filling the underfill between each of the chips and the package substrate.