Pre-package and methods of manufacturing semiconductor package and electronic device using the same

摘要

Methods of fabricating semiconductor packages are provided. One of the methods includes forming a protection layer including metal on a first surface of a substrate to cover a semiconductor device disposed on the first surface of the substrate, attaching a support substrate to the protection layer by using an adhesive member, processing a second surface of the substrate opposite to the protection layer to remove a part of the substrate, and detaching the support substrate from the substrate.

主权项

1. A method of fabricating a semiconductor package, the method comprising:
forming a protection layer including metal continuously formed on a first surface of a substrate to cover a plurality of semiconductor devices that are disposed on the first surface of the substrate; attaching a support substrate to a top surface of the protection layer by using an adhesive member; processing a second surface of the substrate opposite to the protection layer to remove a portion of the substrate; and detaching the support substrate from the substrate, wherein the protection layer remains to continuously cover the plurality of semiconductor devices after the support substrate is detached from the substrate.