Through package via (TPV)

摘要

A through package vias (TPV), a package including a plurality of the TPVs, and a method of forming the through package via are provided. Embodiments of a through package via (TPV) for a package include a build-up film layer, a metal pad disposed over the build-up film layer, a polymer ring disposed over the metal pad, and a solder feature electrically coupled with the metal pad.

主权项

1. A device comprising:
a die having a first surface and a second surface opposite the first surface; a metal pad having a third surface and a fourth surface opposite the third surface; an encapsulant along sidewalls of the die, the encapsulant having a fifth surface and a sixth surface opposite the fifth surface, the fifth surface of the encapsulant being level with the first surface of the die and the third surface of the metal pad, the fifth surface of the encapsulant extending from die to the metal pad, the encapsulant not extending over the first surface of the die and the third surface of the metal pad;
a polymer ring disposed over fourth surface of the metal pad; anda solder feature electrically coupled with the metal pad, the solder feature being coupled to the metal pad and extending to the sixth surface of the encapsulant.