Apparatus and method for verification of bonding alignment

摘要

Presented herein is a device comprising a common node disposed in a first wafer' a test node disposed in a first wafer and having a plurality of test pads exposed at a first surface of the first wafer. The test node also has test node lines connected to the test pads and that are separated by a first spacing and extend to a second surface of the first wafer. A comb is disposed in a second wafer and has a plurality of comb lines having a second spacing different from the first spacing. Each of the comb lines has a first surface exposed at a first side of the second wafer. The comb lines provide an indication of an alignment of the first wafer and second wafer by a number or arrangement of connections made by the plurality of comb lines between the test node lines and the common node.

主权项

1. A device comprising:
a common node disposed in a first wafer; a test node disposed in the first wafer and having a plurality of test pads exposed at a first surface of the first wafer, the test node further having a plurality of test node lines separated by a first spacing and extending to a second surface of the first wafer and each connected to a respective one of the plurality of test pads; and a comb disposed in a second wafer and having a plurality of comb lines having a second spacing different from the first spacing, each of the comb lines having a first surface exposed at a first side of the second wafer, the comb lines configured to provide an indication of an alignment of the first wafer with the second wafer by a number or arrangement of connections made by the plurality of comb lines between the test node lines and the common node.