发明名称 基板処理装置、半導体装置の製造方法及びプログラム
摘要 In the present invention, a substrate is placed at a predetermined position on a substrate support even though the substrate is deviated on a substrate transfer unit. There is provided a substrate processing apparatus that includes a process chamber, a transfer chamber accommodating a substrate transfer unit, a substrate detecting unit, a memory unit configured to store a first reference position information, a second reference position information and a substrate reference position information and a controller configured to generate a detected position information representing a position of a substrate being transferred in the transfer chamber based on a detection result and to control the substrate transfer unit to place the substrate based on the detected position information, the first reference position information, the substrate reference position information and a difference between the first reference position information and the second reference position information.
申请公布号 JP6029250(B2) 申请公布日期 2016.11.24
申请号 JP20150508599 申请日期 2014.03.26
申请人 株式会社日立国際電気 发明人 高橋 哲;保井 毅;小川 洋行;鍋田 和弥;松浦 直哉
分类号 H01L21/677 主分类号 H01L21/677
代理机构 代理人
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