发明名称 CUTTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cutting device capable of reducing the size of a device by simplifying the entire structure of the device and capable of reducing the number of parts to reduce the manufacturing cost.SOLUTION: The cutting device includes a cassette placing mechanism 6, a carry-out/carry-in mechanism 7 for loading and unloading a workpiece to and from the cassette 60, a temporary placement mechanism 8, a holding table 34, a cutting mechanism 4, and a processing feed mechanism for processing and feeding the holding table in a processing feed direction (X-axis direction). The carry-out/carry-in mechanism includes a gripping member for gripping the workpiece accommodated in the cassette, a pair of regulating pins for regulating the workpiece to a predetermined position, and transporting and moving means for moving a supporting base 72 in a Y-axis direction. The temporary placement mechanism includes a pair of support rails 80 extending in the Y-axis direction and having a bottom portion and a side portion that support both side portions of the workpiece, the bottom portion capable of being opened and closed, opening/closing means for opening and closing the bottom portion of the pair of support rails, and lifting means for vertically moving the support rail.SELECTED DRAWING: Figure 1
申请公布号 JP2016207988(A) 申请公布日期 2016.12.08
申请号 JP20150092101 申请日期 2015.04.28
申请人 DISCO ABRASIVE SYST LTD 发明人 OGAWARA SATOSHI;YAGIHARA JUN;TERASHI KENTARO;AKASE KATSUHIKO;MATSUOKA SHINTARO;TANAKA MANPEI
分类号 H01L21/301;B24B27/06;B24B41/06;H01L21/304;H01L21/677 主分类号 H01L21/301
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