Contacting chip module outside of card body, with sections of conductor exposed and raised out of card body, by spot welding

摘要

Chip module (60) is contacted with section of conductor (30) held by hook device (50) outside of card body. Conductor is in form of pull out wire loop contact section (20), uncovered and gripped by hook (52) to extract conductor wire from cavity (40). Chip module is spot welded to conductor. An independent claim is included for a device to attach a conductor wire and chip module.