| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component built-in substrate that is improved in area efficiency and can be miniaturized. <P>SOLUTION: The component built-in substrate 21 comprises insulating layers 22-24; conductive wiring layers 25-28 arranged along each main surface of the insulating layers 22-24; electronic components 30 built into the insulating layer 23; and the electronic components 29 and 31 that are arranged at a side opposite to the electronic components 30 via the conductive wiring layer 26 and built into the insulating layer 22. In the component built-in substrate 21, a terminal 39 of the electronic components 30 is electrically connected to a land electrode 33 provided at the conductive wiring layer 26 from one surface side, a terminal 38 of the electronic components 29 is electrically connected from the other surface side, and a terminal 40 of the electronic components 30 is electrically connected to the land electrode 34 from one surface side, and a terminal 43 of the electronic component 31 is electrically connected from the other surface side. <P>COPYRIGHT: (C)2007,JPO&INPIT |
