MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD

摘要

A method for manufacturing a PCB(Printed Circuit Board) is provided to prevent a short circuit by reducing the unnecessary contact of a burr. A method for manufacturing a PCB includes the steps of: forming an external layer circuit on a predetermined part of a substrate(S110); coating a PSR(Photo Solder Resist) on top and bottom external layers of the substrate where the external layer circuit is formed(S120); treating a cut part of the substrate where the PSR is coated with a resist(S130); and cutting the cut part treated with the resist(S140). The method for manufacturing the PCB further includes the step of removing residual resists on the cut part of the cut substrate after the step S140.