| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-temperature calcination type silver paste, capable of being calcined at a low heat treatment temperature and obtaining a low specific resistance, and moreover, is capable of forming a conductive layer, such as a circuit through printing, without the need for containing a binder. SOLUTION: The paste contains at least metallic nanoparticles covered with organic protective colloid, a silver filler, and a dispersant. The organic protective colloid and the dispersant have a decomposition temperature or a boiling point in the range of 70 to 250°C. The metallic nano particles can be prevented from being condensed by the organic protective colloid and can be calcined at a low temperature and coupled by the silver filler. COPYRIGHT: (C)2008,JPO&INPIT
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