| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board information acquisition and conversion device and method and its program for generating an analytic model matched with the purpose of analysis by acquiring layer configurations, wiring patterns, and viahole shapes or the like from substrate design information, and optimizing the output object range of a viahole based on a package area or thermal density distributions or power consumption or the like before converting it into an analytic model. SOLUTION: This circuit board information acquisition and conversion method and its program and device includes circuit board design information acquisition processing for acquiring circuit board design information having the information of the heat transmission path of a circuit board; a conversion information definition processing for merge-deciding whether or not the heat transmission path should be merged based on the circuit board design information; and analytic model conversion processing for merging the heat transmission path on the basis of the board design information and the result of the merge-deciding, for converting the physical value of the merged heat transmission path into a value equivalent to the physical value of the heat transmission path before merging, and for generating a thermal analytic model. COPYRIGHT: (C)2008,JPO&INPIT
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