WAFER PROCESSING TAPE

摘要

A wafer processing tape (10) is provided with a long mold release film (11); an adhesive layer (12) which is arranged on a first surface (11a) of the mold release film (11) and has a flat shape; an adhesive film which has a label section (13a) having a flat shape, and a peripheral section (13b) surrounding the outer side of the label section (13a); and a supporting member (14) which is a second surface (11b) opposite to the first surface (11a) of the mold release film (11) and arranged at the both end sections of the mold release film (11) in the short side direction. The linear expansion coefficient of the supporting member (14) is 300ppm/°C or below.