GROOVED SUBSTRATES FOR UNIFORM UNDERFILLING SOLDER BALL ASSEMBLED ELECTRONIC DEVICES
摘要
A semiconductor assembly (300) comprising a semiconductor device (301), which has a plurality of metallic contact pads (302) and an outline by sides (303). A metallic bump (304) made of reflowable metal is attached to each of these contact pads. An electrically insulating substrate (305) has a surface with a plurality of metallic terminal pads (306) in locations matching the locations of the device contact pads, and further a plurality of grooves (310) and humps (311) distributed between the terminal pad locations, complementing the distribution of the terminal pads. Each bump is further attached to its matching terminal pad, respectively; the device is thus interconnected with the substrate and spaced apart by a gap (320). Adherent polymeric material (330) containing inorganic fillers fills the gap substantially without voids.
申请公布号
WO2006029169(A3)
申请公布日期
2009.04.23
申请号
WO2005US31740
申请日期
2005.09.06
申请人
TEXAS INSTRUMENTS INCORPORATED;LIBRES, JEREMIAS, P.;MEDIAN, JOEL, T.;MILLER, MARY, C.
发明人
LIBRES, JEREMIAS, P.;MEDIAN, JOEL, T.;MILLER, MARY, C.