The purpose of the present invention is to provide a hydrogen-releasing film and a hydrogen-releasing laminated film which are less susceptible to embrittling at an ambient operating temperature of an electrochemical element. This hydrogen-releasing film is characterized by containing a Pd-Cu alloy, and the Cu content in the Pd-Cu alloy being at least 30 mol%.
申请公布号
EP3031517(A1)
申请公布日期
2016.06.15
申请号
EP20140835365
申请日期
2014.07.30
申请人
NITTO DENKO CORPORATION;NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY;INSTITUTE OF NATIONAL COLLEGES OF TECHNOLOGY, JAPAN
