| 摘要 |
An object of the invention is to provide a cooler, having a small number of parts and a simple structure, which can automatically enhance cooling capacity when at high temperature, and a semiconductor device which is easy to assemble. A cooler which cools a semiconductor module includes a top plate; a jacket, having a side plate and a bottom plate, the side plate of which is firmly fixed to the top plate; a refrigerant inflow port through which a refrigerant flows into a space surrounded by the top plate and jacket; a refrigerant outflow port through which the refrigerant flows out from the space; a plurality of fins, firmly fixed to the top plate, a plurality of which are disposed separately on each of the left and right of a main refrigerant path in the jacket, and which are disposed inclined toward the inflow side of the main refrigerant path; heat transfer pins disposed in positions on the top plate on the refrigerant inflow sides of the fins; and a curved plate-like bimetallic valve, one end of which is connected to each respective heat transfer pin, and the other end of which is a free end. |
