| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board with a cavity, capable of suppressing the generation of voids between an electronic component and the wiring board when the electronic component is mounted thereon, and a manufacturing method thereof.SOLUTION: A wiring board 10 with a cavity includes: a second conductor layer 16B comprising a conductor circuit layer 31B and a conductor plane layer 31A formed therein; a third insulation layer 15C laminated on the second conductor layer 16B; and a cavity 30 for mounting an electronic component, penetrating through the third insulation layer 15C and exposing at least a part of the upper surface 31a of the conductor plane layer 31A, as a bottom surface. An exposed surface 36 on the upper surface 31a of the conductor plane layer 31A is a surface smoother than the upper surface 31b of the conductor circuit layer 31B.SELECTED DRAWING: Figure 1 |
