| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board which does not cause electrical short circuit between a pad pattern and a solid pattern which surrounds the pad pattern and which has excellent electrical insulation reliability.SOLUTION: In a wiring board manufacturing method, a solder resist layer 3 for exposing part of a wiring conductor 2 as a semiconductor element connection pad 4 is formed by: applying a first photosensitive resin paste thinner than a width W of a gap G on the wiring conductor 2 and an insulating substrate 1 and dehydrating the first photosensitive resin paste to form a photosensitive resin layer 3aP; subsequently applying on the first photosensitive resin layer, a second photosensitive resin paste thinner than the width of the gap G and dehydrating the second photosensitive resin paste to form a second photosensitive resin layer 3bP; subsequently, exposing and developing the first and second photosensitive resin layers 3aP, 3bP simultaneously; and subsequently, thermally curing the first and second photosensitive resin layers 3aP, 3bP.SELECTED DRAWING: Figure 4E |
