| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module structure which enables reduction of heat resistance needed in a frame body, and to provide a manufacturing method of the power module structure.SOLUTION: A power module structure includes: a cooler 5; a circuit board 12 disposed on the cooler; semiconductor elements 15a, 15b mounted on the circuit board; a plate-like lead 20 connected with one of the semiconductor elements and the circuit board; and a frame body 500 which is disposed on the cooler so as to surround the circuit board. The lead integrally includes: a plate-like part 20a which contacts with one of the semiconductor elements and the circuit board; an erection part 20b erected from the plate-like part; and a terminal part 20c which is bent from an upper end part of the erection part and positioned on an upper surface side of the frame body. A protruding part 501 which contacts with the inner side of the upper end part of the erection part of the lead is formed in the frame body.SELECTED DRAWING: Figure 3 |
