发明名称 PREPREG INCLUDING POLYPHENYLENE ETHER PARTICLE
摘要 PROBLEM TO BE SOLVED: To provide: a dispersion liquid containing a resin composition including PPE particles, which gives low dielectric constant and dielectric loss tangent which polyphenylene ether (PPE) originally has, and excellent heat resistance and adhesiveness; a prepreg manufactured by using the dispersion liquid; and a printed wiring board manufactured from the prepreg.SOLUTION: In a dispersion liquid containing a resin composition including PPE particles and a solvent, (1) PPE particles have such a size that the major axis is ≤30 μm, (2) ≥60% of the total particle number of the PPE particles has such a size that the major axis is ≥3 μm and ≤20 μm, (3) the PPE particles include ≥70 mass% PPE, and (4) the number average molecular weight of PPE included in the PPE particles is 8,000-40,000.
申请公布号 JP2013194137(A) 申请公布日期 2013.09.30
申请号 JP20120062728 申请日期 2012.03.19
申请人 ASAHI KASEI E-MATERIALS CORP 发明人 ENDO MASAO;UTSUMI TAKAMITSU
分类号 C08L71/12;C08J5/24 主分类号 C08L71/12
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