发明名称 |
Semiconductor wafer with protection structure against damage during a die separation process |
摘要 |
A semiconductor wafer includes one or more dies, each of which has a boundary surrounding an integrated circuitry for separating one from another. One or more pattern units are disposed adjacent to the die for monitoring a fabrication process thereof. A protection structure is disposed between the die and the pattern units for preventing the die from damage during a separation of the die from the semiconductor wafer. Thus, the semiconductor wafer is adapted to prevent damage during a die separation process.
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申请公布号 |
US2006125059(A1) |
申请公布日期 |
2006.06.15 |
申请号 |
US20040012760 |
申请日期 |
2004.12.15 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
CHEN HSIEN-WEI;TSAI HAO-YI;HSU SHIH-HSUN;LOU BAI-YAO |
分类号 |
H01L23/544 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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