| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heating device capable of suppressing temperature rise in the circumference of an electronic component upon heating the electronic component. <P>SOLUTION: A heating nozzle 12 defines an ejecting port 13 for ejecting high-temperature air. Air ejecting nozzles 22 are arranged around the heating nozzle 12. The air ejecting nozzles 22 make air flow at a position apart from the heating nozzle 12. In such a heating device 11, the ejecting port 13 of the heating nozzle 12 is faced to the electronic component 43 upon removing the electronic component 43 such as a chip or the like from a substrate 42. The electronic component 43 is exposed in high temperature based on the high-temperature air. A conductive terminal 44 is molten. On the other hand, the temperature rise around the electronic component 43 is suppressed by the operation of air stream produced by the air ejecting nozzles 22. The temperature rise of the electronic components 45 mounted around the electronic component 43, for example, can be suppressed. The rapture of the circumferential electronic components 45 can be avoided. <P>COPYRIGHT: (C)2007,JPO&INPIT |
