| 摘要 |
Radio Frequency Identification Devices (RFIDs) sometimes fail because of a break in the connection between a microchip mounted on a substrate sheet and a conductive track printed on the substrate forming an antenna for the device, owing to twisting or bending of the substrate. The problem is solved by depositing conductive material forming the conductive track over a surface of the component 2, thereby making electrical contact with it. The conductive material may serve as an adhesive which attaches the component to the substrate. The component may be positioned within a recess in the substrate, with the conductive material deposited into the recess which is, shaped as a channel 1A corresponding to a desired track pattern. |
