PREPREG AND METAL-CLAD SUBSTRATE FOR PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a prepreg which can demonstrate excellent high frequency characteristics expressed by a low dielectric constant and a low dielectric loss and high heat cycle resistance and a metal-clad substrate for a printed wiring board.

SOLUTION: The prepreg is manufactured by heat-pressing a sheet-shaped molding (A) of a graft copolymer (a) and a resin-impregnated sheet-shaped fiber reinforcement material (B) obtained by impregnating a sheet-shaped fiber reinforcement material (b1) with a thermoplastic resin (b2). The graft copolymer is produced by graft-polymerizing 15-40 pts.mass of an aromatic vinyl monomer on 60-85 pts.mass of a random or block copolymer comprising monomer units of a non-polarα-olefin monomer or a non-polar conjugated diene monomer. The thermoplastic resin (b2) is a random or block copolymer comprising 60-90 mass% of monomer units of a non-polarα-olefin monomer or a non-polar conjugated diene monomer and 10-40 mass% of an aromatic vinyl monomer.

COPYRIGHT: (C)2008,JPO&INPIT