| 摘要 |
PROBLEM TO BE SOLVED: To provide a suction pad for semiconductor wafer which can prevent problems that a top of a carbon fiber is exposed to scrape a semiconductor wafer, and a short carbon fiber is left out to be particlized. SOLUTION: The suction pad for semiconductor wafer comprises: a disk 1; an annular fitting rib 2 which is formed on the back surface of the disk 1; a plurality of projections which is formed on the front surface of the disk 1; an intake 4 which is formed at the center of the disk 1; an annular strain prevention groove 5 which is formed on the front surface of the disk 1 so as to correspond to the fitting rib 2, and partitions the front surface of the disk 1 into an inner area 6 and an outer area 7; a plurality of mounting holes 9 which are formed in the inner area 6; and a plurality of partition reinforcement ribs 10, which partitions the strain prevention groove 5 into a plurality of grooves, to reinforce the suction pad for semiconductor wafer. The suction pad for semiconductor wafer is made by injection molding of a thermoplastic compound having a volume resistivity of 1.0×10<SP>0</SP>to 1.0×10<SP>13</SP>(Ωcm) and mounted on an arm of a robot. A semiconductor wafer W is suctioned and held by driving a vacuum apparatus of the robot. COPYRIGHT: (C)2008,JPO&INPIT |
