发明名称 |
THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF |
摘要 |
Components and materials, including thermal interface materials, described herein include at least one matrix component, at least one high conductivity component, and at least one solder material. In some embodiments, the at least one high conductivity component includes a filler component, a lattice component or a combination thereof. Methods are also described herein of producing a thermal interface material that include providing at least one matrix component, providing at least one high conductivity component, providing at least one solder material, and blending the at least one matrix component, the at least one high conductivity component and the at least one solder material. |
申请公布号 |
WO2008014171(A3) |
申请公布日期 |
2008.03.20 |
申请号 |
WO2007US73865 |
申请日期 |
2007.07.19 |
申请人 |
HONEYWELL INTERNATIONAL INC.;WEISER, MARTIN, W.;RASTOGI, RAVI;NERURKAR, MEGHANA;MATHUR, DEVESH;TONG, COLIN |
发明人 |
WEISER, MARTIN, W.;RASTOGI, RAVI;NERURKAR, MEGHANA;MATHUR, DEVESH;TONG, COLIN |
分类号 |
H01L23/373 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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