| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip-on-film having moderate modulus in combination with high dimensional stability and also having excellent slipperiness and bendability, and adaptable to the automatic optical inspection (AOI) system. SOLUTION: The chip-on-film has a wiring formed on at least one side of a polyimide film so as to mount IC chips. In this chip-on-film, the polyimide film is composed mainly of 3,4'-diaminodiphenyl ether and 4,4'-diaminodiphenyl ether as diamine components and pyrromellitic dianhydride as an acid dianhydride component, and 0.1-0.9 wt.%, per film resin weight of inorganic particles being 0.01-1.5μm in size with an average size of 0.05-0.7μm and having such a size distribution that particles 0.15-0.60μm in size account for 80 vol.% or greater of the total particles are dispersed in the polyimide film. COPYRIGHT: (C)2008,JPO&INPIT
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