| 摘要 |
A routing layer for a microelectronic device includes a first region (110, 510) containing a first trench (111, 511), a second region (120, 520) containing a second trench (121, 521), and an electrically conductive material (230, 530) in the first trench and in the second trench. The first trench has a first depth (115) and the second trench has a second depth (125) that is different from the first depth.
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