| 发明名称 |
POLISHING AGENT, STOCK SOLUTION FOR POLISHING AGENT, AND POLISHING METHOD |
| 摘要 |
This polishing agent for resin polishing contains: abrasive particles; a water-soluble polymer that has an ether bond; an organic solvent; and water. Therein, the abrasive particles have a positive charge within the polishing agent, and the average particle size of the abrasive particles is larger than 20 nm. |
| 申请公布号 |
WO2016143797(A1) |
申请公布日期 |
2016.09.15 |
| 申请号 |
WO2016JP57222 |
申请日期 |
2016.03.08 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
HANANO Masayuki;NISHIYAMA Masaya;GOH Yutaka;SAKURAI Haruaki;IWANO Tomohiro |
| 分类号 |
C09K3/14;B24B37/00;C09G1/02;H01L21/304 |
主分类号 |
C09K3/14 |
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