发明名称 |
MULTILAYER HEAT-CONDUCTIVE SHEET, AND MANUFACTURING METHOD FOR MULTILAYER HEAT-CONDUCTIVE SHEET |
摘要 |
Peeling due to interfacial fracture between a tack-free layer 11 and a heat-conductive layer is prevented. In the tack-free layer, an inorganic filler having a median diameter of 0.5 μM or more is contained in a thermoplastic resin having a glass transition temperature of 60° C. or higher to form concaves and convexes on an adhesive surface. Then, the heat-conductive layer being in contact with the adhesive surface is disposed. The adhesion between the tack-free layer and the heat-conductive layer is strengthened by an anchor effect caused by the concaves and convexes of the adhesive surface, without strengthening the adhesion of the surface opposite to the adhesive surface. |
申请公布号 |
US2016372400(A1) |
申请公布日期 |
2016.12.22 |
申请号 |
US201615257013 |
申请日期 |
2016.09.06 |
申请人 |
DEXERIALS CORPORATION |
发明人 |
SUGITA Junichiro |
分类号 |
H01L23/373;H01L21/48 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
1. A multilayer heat-conductive sheet comprising a heat-conductive layer and a tack-free layer being in contact with each other, wherein
the heat-conductive layer includes a binder resin, the tack-free layer includes
a thermoplastic resin having a glass transition temperature of 60° C. or higher, andan inorganic filler having a median diameter of 0.5 μm or more, the tack-free layer has a thickness of at least 3 μm and at most 15 μm, and wherein when the heat-conductive layer and the tack-free layer come into contact with each other, a Bekk smoothness of the tack-free layer is within a range of at least 20 seconds and at most 300 seconds. |
地址 |
Tokyo JP |