发明名称 MULTILAYER HEAT-CONDUCTIVE SHEET, AND MANUFACTURING METHOD FOR MULTILAYER HEAT-CONDUCTIVE SHEET
摘要 Peeling due to interfacial fracture between a tack-free layer 11 and a heat-conductive layer is prevented. In the tack-free layer, an inorganic filler having a median diameter of 0.5 μM or more is contained in a thermoplastic resin having a glass transition temperature of 60° C. or higher to form concaves and convexes on an adhesive surface. Then, the heat-conductive layer being in contact with the adhesive surface is disposed. The adhesion between the tack-free layer and the heat-conductive layer is strengthened by an anchor effect caused by the concaves and convexes of the adhesive surface, without strengthening the adhesion of the surface opposite to the adhesive surface.
申请公布号 US2016372400(A1) 申请公布日期 2016.12.22
申请号 US201615257013 申请日期 2016.09.06
申请人 DEXERIALS CORPORATION 发明人 SUGITA Junichiro
分类号 H01L23/373;H01L21/48 主分类号 H01L23/373
代理机构 代理人
主权项 1. A multilayer heat-conductive sheet comprising a heat-conductive layer and a tack-free layer being in contact with each other, wherein the heat-conductive layer includes a binder resin, the tack-free layer includes a thermoplastic resin having a glass transition temperature of 60° C. or higher, andan inorganic filler having a median diameter of 0.5 μm or more, the tack-free layer has a thickness of at least 3 μm and at most 15 μm, and wherein when the heat-conductive layer and the tack-free layer come into contact with each other, a Bekk smoothness of the tack-free layer is within a range of at least 20 seconds and at most 300 seconds.
地址 Tokyo JP