发明名称 |
METHOD OF ELECTROPLATING A WORKPIECE HAVING HIGH-ASPECT RATIO HOLES |
摘要 |
<p>In order to electroplate workpieces comprising high-aspect ratio holes a method is disclosed comprising the steps bringing the workpiece and at least one anode into contact with a metal plating electrolyte, and applying a voltage between the workpiece and the anodes, to the effect that a current flow is provided to the workpiece. The current flow is a pulse reverse current flow having a frequency of at most about 6 Hertz. According to the frequency each cycle time comprises at least one forward current pulse and at least one reverse current pulse.</p> |
申请公布号 |
WO2004081262(A1) |
申请公布日期 |
2004.09.23 |
申请号 |
WO2004EP02208 |
申请日期 |
2004.02.04 |
申请人 |
ATOTECH DEUTSCHLAND GMBH;REENTS, BERT;MAGAYA, TAFADZWA |
发明人 |
REENTS, BERT;MAGAYA, TAFADZWA |
分类号 |
C25D5/08;C25D5/18;C25D7/12;H01L21/288;H05K3/42;(IPC1-7):C25D7/12;H05K3/24 |
主分类号 |
C25D5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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