| 摘要 |
A heat dissipation device for dissipating heat from an electronic element includes a heat spreader ( 12 ) for contacting with the electronic element, a conducting member ( 30 ) having a lower base plate ( 32 ) thermally contacting with the heat spreader and an upper base plate ( 34 ) with a plurality of first fins ( 36 ) extending downwardly from the upper base plate towards the lower base plate and a connecting portion ( 33 ) interconnecting the lower and upper base plate. A plurality of second fins ( 38 ) is mounted on the conducting member. A plurality of heat pipes ( 40 ) thermally connects the heat spreader and the conducting member and the second fins to transfer heat from the heat spreader to the conducting member and the second fins. A fan ( 20 ) is mounted adjacent to air passages of the first and second fins for generating a forced airflow through the air passages.
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